54819-0519
Mini USB, B-Receptacle, Right-Angle, Through Hole Solder Tails and Shell Tabs, Lead-Free
Part Aliases: Molex 0548190519
Enhance your connectivity with this Mini USB Receptacle, designed for efficient data transfer in compact devices. Featuring a right-angle orientation, through hole solder tails, and shell tabs, it offers secure and stable attachment. The lead-free construction prioritizes environmental sustainability while ensuring high performance with a maximum amperage of 1A and a voltage rating of 30V. With five gold-plated contacts, this USB OTG (On-The-Go) connector guarantees reliable signal transmission. Its thermoplastic body, shielded design, and polarized mating orientation further enhance durability and signal integrity, making it an essential component for high-speed data applications. RoHS compliant and suitable for reflow soldering, it meets stringent industry standards for quality and reliability. Elevate your connectivity solutions with this versatile USB connector.
Details
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 54819-0519 |
Color: | Black |
Series: | 54819 - USB 2.0 - USB OTG (On-The-Go) |
Amperage: | 1 A |
Connector Type: | USB, USB OTG (On-The-Go) |
Gender: | Female |
Number of Contacts: | 5 |
Termination Method: | Through Hole |
Contact Material: | High Performance Alloy (HPA) |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -20 °C |
Body Orientation: | Right Angle |
Pitch: | 8 mm |
Voltage: | 30 V |
Material: | Thermoplastic |
Orientation: | Right Angle |
USB Type: | Mini-B |
Component Type: | Receptacle |
Tail Length: | 1.8 mm |
Operating Temperature Range: | -20 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 5 |
Shielded: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 1.016 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1 mm |
Supplier Product Group: | High Speed Cage & Connector Assemblies |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 010 |
Max. Cycles at Max. Process Temperature: | 001 |
Lock to Mating Part: | Yes |
Surface Mount Compatible: | Yes |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0548190519 |
SKU: | MOL54819-0519 |
Frequently bought together
Compliance
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |