15-80-0149
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38
Part Aliases: Molex 0015800149 Molex A-70567-0277
Enhance your PCB connectivity with our C-Grid Wire to Board Connector, featuring a straight orientation for seamless integration. With 14 contacts arranged in 2 rows, this connector ensures reliable power and signal transmission. Crafted from high temperature thermoplastic and boasting gold plating in the contact mating area, it guarantees durability and optimal conductivity. The through-hole termination method and solder process compatibility make installation a breeze. UL and CSA agency certifications, along with RoHS compliance, guarantee the highest quality standards. Whether it's for industrial machinery or consumer electronics, this connector is a versatile and essential component for your projects. Elevate your PCB assembly with our C-Grid Connector and experience seamless performance and longevity.
Details
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 15-80-0149 |
| Color: | Black |
| Series: | 70567 - C-Grid |
| Amperage: | 2.5 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 14 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 250 VDC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 3.3 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 14 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 1.905 µm |
| Polarized to Mate: | No |
| PCB Thickness (Recommended): | 2.36 mm |
| Connector System: | Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 245 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 2.54 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Open Ends |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0015800149 A-70567-0277 |
| SKU: | MOL15-80-0149 |
Frequently bought together
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |