Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 56134-9100 |
Series: | 56134 - MicroClasp - MUO 2.5 |
Connector Type: | MicroClasp, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper-Nickel-Silicon |
Contact Plating: | Tin |
Packaging: | Bag |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.7 mm |
Part Aliases: | 0561349100 |
SKU: | MOL56134-9100 |
56134-9100
Heilind Number: | MOL56134-9100 |
Manufacturer: | Molex |
Manufacturer Number: | 56134-9100 |
Datasheet: | RoHS Certificate of Compliance |
ECAD Model: |
Specifications
Detailed Description
Easily connect wires with our MicroClasp - MUO 2.5 Female Connector. Designed for 24-28 AWG wire sizes, this versatile connector offers reliable signal transmission in various circuit applications. With copper-nickel-silicon contacts and tin plating, it ensures optimal conductivity and durability. The crimp or compression termination method allows for easy installation, while the RoHS compliance guarantees environmental responsibility. Perfect for wire-to-board connections, this connector is a must-have for any project requiring secure and efficient signal transmission.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
09/15/2016 | 501416 - Equipment Transfer, Production Transfer or Rearrangement. | Download |