26-60-4030

Heilind Number:MOL26-60-4030
Manufacturer:Molex
Manufacturer Number:26-60-4030
Datasheet:Drawing
ECAD Model:
3D Model

Description:

KK 396 Header, Vertical, Friction Lock, 3 Circuits, Tin (Sn) Plating

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 26-60-4030
Color:Natural
Series:41791 - KK 396
Amperage:7 A
Connector Type:KK 396
Number of Contacts:3
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Straight
Pitch:3.96 mm
Voltage:250 V
Material:Polyester
Orientation:Vertical
Tail Length:3.56 mm
Packaging:Bag
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:5.08 µm
Number of Contacts Loaded:3
Mating Cycles:25
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:5.08 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:235 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):005
Max. Cycles at Max. Process Temperature:001
Glow Wire Capable:No
Lock to Mating Part:Yes
Stackable:Yes
Breakaway:No
Shroud Type:Partial
Material Flammability Standard:94V-0
Part Aliases:0026604030 41791-0003
SKU:MOL26-60-4030

Detailed Description

Easily connect wires to a PCB with our KK 396 Header, featuring a vertical, friction lock design for secure attachment. This component boasts three circuits with tin plating for optimal conductivity, suitable for applications up to 7A and 250V. Constructed with durable polyester and brass materials, it ensures reliable performance. The straight orientation and through-hole termination method make installation straightforward. With a pitch of 3.96mm and a tail length of 3.56mm, it is compatible with various PCBs. Certified for RoHS compliance and UL standards, it meets stringent quality requirements. Perfect for wire-to-board connections in electronic assemblies.