logo
12/7/2019 11:54:58 PM
Home menu sep Linecard menu sep Search menu sep View Cart menu sep Order Status menu sep Contact Us
You are not logged in. Please Log in.
 

1-332070-4

Search for a Part:
Part Number:
Manufacturer:
Search Mode: begins with  contains  exact match 
Max Results:

Part Number Available for Immediate Shipment Stock to Build Factory Stock(FS) or Lead Time if Heilind out of Stock Min/Mult Pricing Quantity

1-332070-4

15,753 0 195 Days

1/1
1 … $0.47034E
400 … $0.40620E
1,000 … $0.39425E
1,900 … $0.38299E
3,800 … $0.38299E
15,753 … $0.38299E


Details
Tariff Info: HTS: 85366980
Mfg Part #:

1-332070-4

Disty Part #: AMP1-332070-4
Manufacturer: TE CNTY AMP
Part Description: SOCKET,MIN-SPR W/H AU SER-4
Unit of Measure: Each
Data Sheet:

1-332070-4

RoHS: 1-332070-4 RoHS Compliant Yes
Series: 377 - Mini-Spring Sockets
Category: Discrete Sockets
Larger Image 1-332070-4 image large

Image for
Reference only

1-332070-4 image thumbnail

Product Features

Features
Product Type Features
Wire/Cable TypeDiscrete Wire
Product Series5.0
ProfileZero
Product LineMini-Spring Socket
SealantWithout
Sleeve StyleOpen Bottom
Electrical Characteristics
Contact - Rated Current7.5 A
Termination Features
Termination Method to Wire/CableSolder
Termination Method to PC BoardThrough Hole - Press Fit
Wire/Cable Size0.653 mm²
Wire/Cable Size19.0 AWG
Insertion MethodHand/Semi-Automatic
Dimensions
PCB Thickness, Recommended0.79 - 3.18 mm
PCB Thickness, Recommended0.031 - 0.125 in
Recommended Hole Size1.83 mm
Recommended Hole Size0.072 in
Socket Length3.63 mm
Socket Length0.143 in
Body Features
Spring MaterialBeryllium Copper
Sleeve MaterialCopper
Sleeve Material PlatingGold Flash over Nickel
Wire TypeSolid
Mating Pin Dia. Range0.94 - 1.02 mm
Mating Pin Dia. Range0.037 - 0.04 in
Contact Features
Contact TypeSocket
Contact Base MaterialBeryllium Copper
Contact Plating, Mating Area, MaterialGold (30)
Contact Plating, Mating Area, Thickness7.6E-4 µm
Contact Plating, Mating Area, Thickness0.03 µin
Contact Spring PlatingGold (30)
Industry Standards
Government/Industry QualificationNo
RoHS/ELV ComplianceRoHS compliant
RoHS/ELV ComplianceELV compliant
Lead Free Solder ProcessesWave solder capable to 240°C
Lead Free Solder ProcessesWave solder capable to 260°C
Lead Free Solder ProcessesWave solder capable to 265°C
Lead Free Solder ProcessesReflow solder capable to 245°C
Lead Free Solder ProcessesReflow solder capable to 260°C
Lead Free Solder ProcessesPin-in-Paste capable to 245°C
Lead Free Solder ProcessesPin-in-Paste capable to 260°C
RoHS/ELV Compliance HistoryAlways was RoHS compliant
Environmental
Operating Temperature-65.0 - 126.0 °C
Operating Temperature-85.0 - 258.0 °F
Conditions for Usage
Applies ToWire/Cable
Applies ToPrinted Circuit Board
Operation/Application
ApplicationProduction
Application UseWire-to-Board
Application UseBoard-to-Board
Contact Transmits (Typical Application)Signal (Data)/Power
Packaging Features
Packaging MethodLoose Piece
Packaging Quantity2,000/Bag
Other
BrandAMP

Product Line/Family

Mfg Part # Descriptiontop
2-331677-2 SOCKET,MIN-SPR W/H SN-AU SER-3
2-5050871-3 SOCKET,MIN-SPR SN-AU SER-5
50462-6 SOCKET,MIN-SPR AU SER-2
5050865-5 SOCKET,MIN-SPR SN-AU SER-4
5050871-8 SOCKET,MIN-SPR SN SER-5
5645500-1 SOCKET,MSS SER 4 BN SN AU



 

© 2019 Heilind Electronics

Help | Privacy | Legal | Terms and Conditions