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1367073-1

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1367073-1

368 28800
(2 Days)
73 Days

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1 … $1.96970E
90 … $1.70110E
230 … $1.65100E
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Details
Tariff Info: HTS: 85366940 - This Line May Be Subject To Section 301 Tariff at 17%
Mfg Part #:

1367073-1

Disty Part #: AMP1367073-1.P
Manufacturer: TE CNTY AMP
Part Description: CUT TAPE - 20 POS SMT CONN, SFP, 15AU
Unit of Measure: Each
Data Sheet:

1367073-1

RoHS: 1367073-1 RoHS Compliant Yes
Series: 077 - SFP Pluggable I/O
Category: Pluggable Connectors, Cages & Accessories
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Product Change Notice

Effective Date Description of Change Download
11/30/2017 E-17-006009 - Product Improvement. This change is considered by TE Connectivity as: UPDATE NICKEL PLATING SPEC FROM 0.0038MM MINUMAL TO 0.00127 MM MINUMAL.1367073-1
12/12/2016 P-16-013551 - Document clarification. Change Tape Raw material(Color from Black to pure).1367073-1
1/12/2014 P-13-009785 - Product Improvement.1367073-1
11/12/2013 P-13-009786 - Product Improvement.1367073-1
8/9/2012 Non Fit-Founction changes to components.(Mating interface and footprint remain the same, only the location of Brand is changed, and add the mark of material on the top surface of product).NA [?File not available for download.]

Product Features

Features
Product Type Features
Product TypeConnector
Product LineSFP
Mechanical Attachment
PCB MountDouble Sided (Belly-to-Belly)
Electrical Characteristics
Data Signal RateUp to 4 Gb/s
Termination Features
Termination Method to PC BoardSurface Mount
Contact Features
Contact Base MaterialPhosphor Bronze
Contact Plating, Mating Area, MaterialGold
Contact Plating, Mating Area, Thickness0.38 µm
Contact Plating, Mating Area, Thickness15.0 µin
Housing Features
Connector StyleReceptacle
Housing MaterialLCP - GF (Liquid Crystal Polymer)
Housing ColorBlack
Industry Standards
RoHS/ELV ComplianceRoHS compliant
RoHS/ELV ComplianceELV compliant
Lead Free Solder ProcessesReflow solder capable to 245°C
Lead Free Solder ProcessesReflow solder capable to 260°C
RoHS/ELV Compliance HistoryAlways was RoHS compliant
UL Flammability RatingUL 94V-0
Conditions for Usage
Applies ToPrinted Circuit Board
Operation/Application
ApplicationSFP
Packaging Features
Packaging MethodReel
Other
BrandAMP

Product Line/Family

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