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2-331677-2

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2-331677-2

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Details
Mfg Part #:

2-331677-2

Disty Part #: AMP2-331677-2
Manufacturer: TE CNTY AMP
Part Description: SOCKET,MIN-SPR W/H SN-AU SER-3
Unit of Measure: Each
Data Sheet:

2-331677-2

RoHS: 2-331677-2 No
Series: 377 - Mini-Spring Sockets
Category: Discrete Sockets
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Product Features

Features
Product Type Features
Wire/Cable TypeDiscrete Wire
Product Series4.0
ProfileZero
Product LineMini-Spring Socket
SealantWithout
Sleeve StyleOpen Bottom
Electrical Characteristics
Contact - Rated Current6.5 A
Termination Features
Termination Method to Wire/CableSolder
Wire/Cable Size0.41 - 0.518 mm²
Wire/Cable Size20.0 - 21.0 AWG
Insertion MethodHand/Semi-Automatic/Automatic
Termination Method to PC BoardThrough Hole - Press Fit
Dimensions
PCB Thickness, Recommended0.79 - 3.18 mm
PCB Thickness, Recommended0.031 - 0.125 in
Recommended Hole Size1.57 mm
Recommended Hole Size0.062 in
Socket Length3.51 mm
Socket Length0.138 in
Body Features
Spring MaterialBeryllium Copper
Sleeve MaterialCopper
Sleeve Material PlatingTin
Wire TypeSolid
Mating Pin Dia. Range0.76 - 0.84 mm
Mating Pin Dia. Range0.03 - 0.033 in
Contact Features
Contact TypeSocket
Contact Base MaterialBeryllium Copper
Contact Plating, Mating Area, MaterialGold (30)
Contact Plating, Mating Area, Thickness7.6E-4 µm
Contact Plating, Mating Area, Thickness0.03 µin
Contact Spring PlatingGold (30)
Industry Standards
Government/Industry QualificationNo
RoHS/ELV ComplianceNot ELV/RoHS compliant
Lead Free Solder ProcessesWave solder capable to 240°C
Lead Free Solder ProcessesWave solder capable to 260°C
Lead Free Solder ProcessesWave solder capable to 265°C
Lead Free Solder ProcessesReflow solder capable to 245°C
Lead Free Solder ProcessesReflow solder capable to 260°C
Lead Free Solder ProcessesPin-in-Paste capable to 245°C
Lead Free Solder ProcessesPin-in-Paste capable to 260°C
Environmental
Operating Temperature-65.0 - 126.0 °C
Operating Temperature-85.0 - 258.0 °F
Conditions for Usage
Applies ToWire/Cable
Applies ToPrinted Circuit Board
Operation/Application
ApplicationProduction
Application UseWire-to-Board
Application UseBoard-to-Board
Contact Transmits (Typical Application)Signal (Data)/Power
Packaging Features
Packaging MethodLoose Piece
Packaging Quantity2,000/Bag
Other
BrandAMP

Product Line/Family

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2-5050871-3 SOCKET,MIN-SPR SN-AU SER-5
50462-6 SOCKET,MIN-SPR AU SER-2
5050865-5 SOCKET,MIN-SPR SN-AU SER-4
5050871-8 SOCKET,MIN-SPR SN SER-5
5645500-1 SOCKET,MSS SER 4 BN SN AU



 

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