Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43860-0004 |
Color: | Black |
Series: | 43860 - Modular Jack 8/8 - RJ45 |
Amperage: | 1.5 A |
Connector Type: | Modular Jack 8/8, RJ45 |
Gender: | Female |
Termination Method: | Through Hole |
Contact Material: | Brass, Phosphor Bronze |
Contact Plating: | Gold |
Body Orientation: | Right Angle |
Pitch: | 1.02 mm |
Voltage: | 150 V AC/DC |
Material: | High Temperature Thermoplastic |
Number of Ports: | 1 |
Orientation: | 90° Angle |
Component Type: | PCB Jack |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 1.27 µm |
Ground to Panel / PCB: | Yes |
Mating Cycles: | 500 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.57 mm |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | 1.02 mm |
Surface Mount Compatible: | No |
Non Magnetic: | Yes |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0438600004 |
SKU: | MOL43860-0004 |
43860-0004
Specifications
Detailed Description
Enhance your networking setup with this high-performance Modular Jack. Designed for seamless connectivity, this RJ45 connector features a right angle, low profile build with inverted shielding and all panel grounding tabs for superior signal integrity. Crafted from durable materials, it ensures reliable performance in various environments, with a wide operating temperature range and compliance with RoHS standards. The gold-plated contacts and brass/phosphor bronze construction guarantee optimal conductivity, while the 90° angle orientation and through-hole termination method offer easy installation on PCBs. With UL and CSA certifications, this connector is a trusted choice for your Ethernet and fiber optic connections.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download | |||
05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download | |||
09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download | |||
01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download | |||
06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download |