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50462-6

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Part Number Available for Immediate Shipment Stock to Build Factory Stock(FS) or Lead Time if Heilind out of Stock Min/Mult Pricing Quantity

50462-6

4,165 0 195 Days

FS Qty - 16000
1/1
1 … $0.29392E
700 … $0.25384E
1,500 … $0.24637E
3,000 … $0.23933E
6,000 … $0.35421E
20,200 … $0.34922E


Details
Tariff Info: HTS: 85389081
Mfg Part #:

50462-6

Disty Part #: AMP50462-6
Manufacturer: TE CNTY AMP
Part Description: SOCKET,MIN-SPR AU SER-2
Unit of Measure: Each
Data Sheet:

50462-6

RoHS: 50462-6 RoHS Compliant Yes
Series: 377 - Mini-Spring Sockets
Category: Discrete Sockets
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Product Features

Features
Product Type Features
Wire/Cable TypeDiscrete Wire
Product Series3
ProfileZero
Product LineMini-Spring Socket
SealantWithout
Sleeve StyleClosed Bottom
Electrical Characteristics
Contact - Rated Current5.0 A
Termination Features
Termination Method to Wire/CableSolder
Termination Method to PC BoardThrough Hole - Press Fit
Wire/Cable Size22.0 - 28.0 AWG
Wire/Cable Size0.081 - 0.326 mm²
Insertion MethodHand/Semi-Automatic
Dimensions
PCB Thickness, Recommended0.79 - 3.18 mm
PCB Thickness, Recommended0.031 - 0.125 in
Recommended Hole Size1.32 mm
Recommended Hole Size0.052 in
Socket Length4.52 mm
Socket Length0.178 in
Body Features
Spring MaterialBeryllium Copper
Sleeve MaterialCopper
Sleeve Material PlatingGold Flash over Nickel
Wire TypeSolid
Mating Pin Dia. Range0.36 - 0.66 mm
Mating Pin Dia. Range0.014 - 0.026 in
Contact Features
Contact TypeSocket
Contact Base MaterialBeryllium Copper
Contact Plating, Mating Area, MaterialGold (30)
Contact Plating, Mating Area, Thickness7.6E-4 µm
Contact Plating, Mating Area, Thickness0.03 µin
Contact Spring PlatingGold (30)
Industry Standards
Government/Industry QualificationNo
RoHS/ELV ComplianceRoHS compliant
RoHS/ELV ComplianceELV compliant
Lead Free Solder ProcessesWave solder capable to 240°C
Lead Free Solder ProcessesWave solder capable to 260°C
Lead Free Solder ProcessesWave solder capable to 265°C
Lead Free Solder ProcessesReflow solder capable to 245°C
Lead Free Solder ProcessesReflow solder capable to 260°C
Lead Free Solder ProcessesPin-in-Paste capable to 245°C
Lead Free Solder ProcessesPin-in-Paste capable to 260°C
RoHS/ELV Compliance HistoryAlways was RoHS compliant
Environmental
Operating Temperature-65.0 - 126.0 °C
Operating Temperature-85.0 - 258.0 °F
Conditions for Usage
Applies ToWire/Cable
Applies ToPrinted Circuit Board
Operation/Application
ApplicationProduction
Application UseWire-to-Board
Application UseBoard-to-Board
Contact Transmits (Typical Application)Signal (Data)/Power
Packaging Features
Packaging MethodLoose Piece
Packaging Quantity2,000/Bag
Other
BrandAMP

Product Line/Family

Mfg Part # Descriptiontop
1-332070-4 SOCKET,MIN-SPR W/H AU SER-4
2-331677-2 SOCKET,MIN-SPR W/H SN-AU SER-3
2-5050871-3 SOCKET,MIN-SPR SN-AU SER-5
5050865-5 SOCKET,MIN-SPR SN-AU SER-4
5050871-8 SOCKET,MIN-SPR SN SER-5
5645500-1 SOCKET,MSS SER 4 BN SN AU



 

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