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5050865-7

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Part Number Available for Immediate Shipment Stock to Build Factory Stock(FS) or Lead Time if Heilind out of Stock Min/Mult Pricing Quantity

5050865-7

 CALL 0 84 Days

 10000/2000
10,000 … $0.30463E
24,000 … $0.30034E
 Please Call 800-400-7041
Details
Mfg Part #:

5050865-7
Disty Part #: AMP5050865-7
Manufacturer: TE CNTY AMP
Part Description: SOCKET,MIN-SPR SN SER-4
Unit of Measure: Each
Data Sheet:

5050865-7
RoHS: 5050865-7 RoHS Compliant Yes
Series: 377 - Mini-Spring Sockets
Category: Discrete Sockets
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Application Tooling
Series

Product Features

Features
Product Type Features
Wire/Cable TypeDiscrete Wire
Product Series5.0
ProfileZero
Product LineMini-Spring Socket
SealantWithout
Sleeve StyleKnockout Bottom
Electrical Characteristics
Contact - Rated Current7.5 A
Termination Features
Termination Method to Wire/CableSolder
Termination Method to PC BoardThrough Hole - Press Fit
Wire/Cable Size0.518 - 0.823 mm²
Wire/Cable Size18.0 - 20.0 AWG
Insertion MethodHand/Semi-Automatic
Dimensions
PCB Thickness, Recommended0.79 - 3.18 mm
PCB Thickness, Recommended0.031 - 0.125 in
Recommended Hole Size1.83 mm
Recommended Hole Size0.072 in
Socket Length6.6 mm
Socket Length0.26 in
Body Features
Spring MaterialBeryllium Copper
Sleeve MaterialCopper
Sleeve Material PlatingTin
Wire TypeSolid
Mating Pin Dia. Range0.86 - 1.04 mm
Mating Pin Dia. Range0.034 - 0.041 in
Contact Features
Contact TypeSocket
Contact Base MaterialBeryllium Copper
Contact Plating, Mating Area, MaterialTin
Contact Plating, Mating Area, Thickness0.00254 µm
Contact Plating, Mating Area, Thickness0.1 µin
Contact Spring PlatingTin
Industry Standards
Government/Industry QualificationNo
RoHS/ELV ComplianceRoHS compliant
RoHS/ELV ComplianceELV compliant
Lead Free Solder ProcessesWave solder capable to 240°C
Lead Free Solder ProcessesWave solder capable to 260°C
Lead Free Solder ProcessesWave solder capable to 265°C
Lead Free Solder ProcessesReflow solder capable to 245°C
Lead Free Solder ProcessesReflow solder capable to 260°C
Lead Free Solder ProcessesPin-in-Paste capable to 245°C
Lead Free Solder ProcessesPin-in-Paste capable to 260°C
RoHS/ELV Compliance HistoryAlways was RoHS compliant
Environmental
Operating Temperature-65.0 - 126.0 °C
Operating Temperature-85.0 - 258.0 °F
Conditions for Usage
Applies ToWire/Cable
Applies ToPrinted Circuit Board
Operation/Application
ApplicationProduction
Application UseWire-to-Board
Application UseBoard-to-Board
Contact Transmits (Typical Application)Signal (Data)/Power
Packaging Features
Packaging MethodLoose Piece
Packaging Quantity2,000/Bag
Other
BrandAMP

Product Line/Family

Mfg Part # Descriptiontop
1-332070-4 SOCKET,MIN-SPR W/H AU SER-4
2-331677-2 SOCKET,MIN-SPR W/H SN-AU SER-3
2-5050871-3 SOCKET,MIN-SPR SN-AU SER-5
50462-6 SOCKET,MIN-SPR AU SER-2
5050865-5 SOCKET,MIN-SPR SN-AU SER-4
5050871-8 SOCKET,MIN-SPR SN SER-5
5645500-1 SOCKET,MSS SER 4 BN SN AU



 

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