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Part Number Available for Immediate Shipment Stock to Build Factory Stock(FS) or Lead Time if Heilind out of Stock Min/Mult Pricing Quantity


72,500 0 95 Days

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Tariff Info: HTS: 85369085
Mfg Part #:


Disty Part #: AMP7-1452671-3
Manufacturer: TE CNTY AMP
Part Description: MCON 1.2 - LL (SWS)
Unit of Measure: Each
Data Sheet:


RoHS: 7-1452671-3 RoHS Compliant Yes
Series: N13 - MCON - Terminals
Category: Multiple Contact Point (MCP) Interconnection System and MCON Contact System
Larger Image 7-1452671-3 image large

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7-1452671-3 image thumbnail

Product Change Notice

Effective Date Description of Change Download
9/15/2019 P-19-017747 - New Process Equipment. This new process equipment will be used to perform the plating-process for parts on component level. As the new process equipment will be technically equivalent to the existing one(s), the process validation, capability analysis and release will be done TE internally. Therefore this PCN is for your notification only.7-1452671-3

Application Tooling

Mfg Part # Descriptiontop
2-2151049-1 OC-PA-S-FM-070F130O-001-0131
2-2151049-2 OC-PA-S-FA-070F130O-001-0131
2151049-1 OC-AT-S-FM-070F130O-001-0131
2151049-2 OC-AT-S-FA-070F130O-001-0131
4-1579001-5 ERGO DIE MCP 1,2 LL EDS
7-2151049-7 OC-070F130O-CRIMPTOOLINGKIT
7-2266356-7 OC-070F130O-CRIMPTOOLINGKIT

Product Features

Product Type Features
Product TypeContact
Wire/Cable TypeFLR (Thin Walled Cable)
Product LineMultiple Contact Point (MCP)
Product LineMCON
Mechanical Attachment
Contact RetentionWith
Contact Retention TypeLocking Lance
Electrical Characteristics
Contact - Rated Current20.0 A
Contact - Rated Current14.0 A
Termination Features
Termination Method to Wire/CableCrimp
Seal TypeSingle Wire Seal(s)
Wire/Cable Size16.0 - 18.0 AWG
Wire/Cable Size1.0 - 1.5 mm²
Mating Area Interface Dimensions.047 in
Mating Area Interface Dimensions1.20 mm
Body Features
Spring MaterialCuNiSi
Wire TypeStranded
Used WithTab Contact
Spring PlatingSilver
Seal MaterialSilicone VMQ 50
Seal ColorGreen
Contact Features
Contact Plating, Mating Area, Thickness1.0 - 3.0 µm
Contact Plating, Mating Area, Thickness39.37 - 118.11 µin
Contact StyleLocking Lance
Contact TypeSocket
Contact Base MaterialCuSn0.15/0.20
Contact Plating, Mating Area, MaterialPre-Tin
Spring Plating, Mating Area, Thickness2.0 - 5.0 µm
Spring Plating, Mating Area, Thickness78.74 - 196.85 µin
Configuration Features
Strain ReliefWithout
Industry Standards
RoHS/ELV ComplianceRoHS compliant
RoHS/ELV ComplianceELV compliant
Lead Free Solder ProcessesNot reviewed for lead free solder process
RoHS/ELV Compliance HistoryAlways was RoHS compliant
Operating Temperature-40.0 - 130.0 °C
Operating Temperature-40.0 - 266.0 °F
Sealing SystemSingle Wire Sealing System (SWS)
Conditions for Usage
Applies ToWire/Cable
Accepts Wire Insulation Diameter, Range1.9 - 2.4 mm
Accepts Wire Insulation Diameter, Range0.075 - 0.094 in
Application UseWire-to-Wire
Packaging Features
Packaging MethodReel
Packaging Quantity6,500
BrandTE Connectivity
CommentSeal P/N 967067-1

Product Line/Family

Mfg Part # Descriptiontop
1-1418390-1 4 POS AMP MCP 2.8 REC HSG
1-1418469-1 6POS,AMP MCP1.5K,REC. HSG,CODA
1-1418483-1 2POS,AMP MCP2.8,REC. HSG,CODA
1-1418883-1 62.POS.MIXED REC.HSG
1-1563759-1 18POS,AMP MCP1.5K,REC HSG,ASSY
1-1564542-1 2POS,AMP MCP6.3/4.8K,REC HSG,A
1-1670918-1 4POS, MCON 1.2 - LL CONNECTOR, SEALED
1-1703639-1 12POS,AMP MCP1.5K,REC HSG,ASSY
1-1718646-1 6POS, MCON 1.2 - LL CONNECTOR, SEALED
1-968976-9 MCP2.8 BU-GEH 3P
1241394-1 AMP MCP 2.8K, CONTACT, SWS
1452388-1 2 LOCKING DEVI1.2
1534594-1 MCON 1.2 - CB
1563111-1 COVER,180
1670146-2 MCON 1.2 - CB (SWS)
1718091-1 AMP MCP 2.8 JPT HSG 17 POS ASS
1718760-3 TAB 1.2 X 0.6 LL
2-1418390-1 4 POS AMP MCP 2.8 REC HSG
8-968972-2 MCP2.8 GEH ASSY 12P
8-968974-1 MCP2.8 GEH 18P
8-968975-2 MCP2.8 GEH ASSY 21P
9-1563172-9 58POS, MIXED,REC HSG,ASSY


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