170432-0002
zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, Surface Mount, 38 Circuits, Gold (Au) Plated 0.762?m, Supports QSFP28 / EDR
Part Aliases: Molex 1704320002
The zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, a high-performance solution for your connectivity needs. Designed for surface mount installation, this assembly features 38 gold-plated circuits with a pitch of 0.8mm, ensuring reliable signal transmission. Supporting QSFP28 and EDR technologies, it is ideal for high-speed applications. The black thermoplastic housing is durable and meets flammability standards, while the copper alloy contacts provide excellent conductivity. With a voltage rating of 30V AC/DC and a current rating of .5A, this assembly offers safe and efficient power delivery. Its right-angle orientation and PCB retention capability make it easy to integrate into your design. RoHS compliant and UL certified, you can trust in the quality and reliability of this component for your projects. Whether used in board-to-board, wire-to-board, or module-to-board connections, the zQSFP+ Assembly is a versatile and essential component in high-speed communication systems.
Details
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 170432-0002 |
| Color: | Black |
| Series: | 170432 - zQSFP Plus - zQSFP |
| Amperage: | .5 A |
| Connector Type: | zQSFP Plus |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Packaging: | Embossed Tape on Reel |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 38 |
| Mating Cycles: | 50 |
| PCB Retention: | Yes |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Board to Board, Module to Board, Wire to Board |
| UL Agency Certification: | E29179 |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1704320002 |
| SKU: | MOL170432-0002 |
Frequently bought together
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/31/2024 | 514009 - Packaging Method/Quantity Changing. This notification is to inform you about the following changes that are being made to the packaging of ZQSFP+ SMT Connector . Change: To standardize the packaging for ZQSFP+ connectors, we are moving away from using the corner guides and white bubble form & switching to pink bubble form. | Download |
| 10/31/2021 | 510998 - Change Supplier. 2021 has caused a global shortage for various grades of resin. this extraordinary event in conjunction with an already constrained market has cause immediate and severe disruption in the industry due to these supply constraints of LCP marketing molex identified an internal shortage of resin supply which would create a challenege to fulfill all orders therefore an alternative resin has been identified. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 05/31/2021 | 510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints. | Download |
| 06/14/2019 | 506859 - Capacity change or tool replacement. Another set of tooling is being added to meet the current and future demands of this product. | Download |
| 08/22/2018 | 502865 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download |
| 06/15/2016 | GCM 10738433 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the assembly method from manually to automatically, this change is to improve the quality performance. We thank you for choose Molex products, you can contact the local sales if any requirement. | Download |