Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43650-0500 |
Color: | Black |
Series: | 43650 |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit 3.0 |
Number of Contacts: | 5 |
Number of Rows: | 1 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Right Angle |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Right Angle |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 2.54 µm |
Number of Contacts Loaded: | 5 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | SMC and Wave |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | Yes |
Mated Height: | 6.98 mm |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit 3.0 |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0436500500 |
SKU: | MOL43650-0500 |
43650-0500
Heilind Number: | MOL43650-0500 |
Manufacturer: | Molex |
Manufacturer Number: | 43650-0500 |
Datasheet: | Packaging Specifications |
ECAD Model: |
Description:
Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 5 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Glow-Wire Capable, Black
More >>Specifications
Detailed Description
Easily integrate power connections with our Micro-Fit 3.0 Right Angle Header. With a 3.00mm pitch and single row design, this header features 5 circuits for efficient connectivity. Crafted with a durable high temperature thermoplastic body and brass contacts plated with tin, it ensures reliable performance in demanding environments. The snap-in plastic peg PCB lock, glow wire capable construction, and black color add functionality and visual appeal. Suitable for through-hole termination, it offers a secure fit on PCBs with a thickness of 1.6mm. With an operating temperature range of -40 to 105 °C and RoHS compliance, it meets industry standards for quality and safety. Perfect for wire-to-board applications, this Micro-Fit 3.0 header is a versatile solution for your connectivity needs.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download | |||
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download | |||
12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download | |||
07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||
05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |