Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 76165-5807 |
Color: | Black |
Series: | 76165 - Impact |
Amperage: | .75 A |
Connector Type: | Impact |
Number of Contacts: | 72 |
Number of Rows: | 9 |
Termination Method: | Through Hole - Compliant Pin |
Contact Material: | High Performance Alloy (HPA) |
Contact Plating: | Gold |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -55 °C |
Pitch: | 1.9 mm |
Voltage: | 30 V AC/DC |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Impedance: | 100 Ω |
Keying: | No |
Component Type: | PCB Header |
Number of Pairs: | 3-pair |
Data Rate: | 25 Gb/s |
Tail Length: | 1.4 mm |
Packaging: | Tray |
Operating Temperature Range: | -55 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 72 |
Mating Cycles: | 200 |
PCB Locator: | No |
Shielded: | No |
PCB Retention: | Without |
Polarized to PCB: | Yes |
PCB Thickness (Recommended): | 1 mm |
Number of Columns: | 8 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Termination Pitch: | 1.9 mm |
Guide to Mating Part: | Yes |
Stackable: | No |
Board to Board Configuration: | Conventional |
Make First / Break Last: | No |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0761655807 |
SKU: | MOL76165-5807 |
76165-5807
Heilind Number: | MOL76165-5807 |
Manufacturer: | Molex |
Manufacturer Number: | 76165-5807 |
Datasheet: | Application Specification |
ECAD Model: |
Description:
Impact 100 Ohm 3 Pair Vertical Backplane Header, Right Guide, Open Endwall, 8 Columns, 72 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.39mm, Lead-Free
More >>Specifications
Detailed Description
Enhance connectivity in your electronic systems with our Impact 100 Ohm 3 Pair Vertical Backplane Header. Designed for high performance, this header features a right guide, open endwall, and 8 columns, accommodating 72 circuits with precision. Its 4.90mm pin length and plated through hole dimension of 0.39mm ensure secure connections, while the lead-free construction aligns with modern environmental standards. Crafted from durable materials, including High Temperature Thermoplastic and High Performance Alloy, it offers reliable operation in a wide temperature range from -55°C to 85°C. With a data rate of 25 Gb/s and impedance of 100Ω, this header is ideal for demanding applications. Additionally, its gold contact plating guarantees low contact resistance and high reliability, with a mating cycle of 200. RoHS compliant and UL certified, it meets stringent quality and safety requirements. Perfect for board-to-board configurations, backplane connections, and more, this header is a versatile solution for your connectivity needs. Elevate your systems with the exceptional performance of our Impact Backplane Header.
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