2309413-1

AMP2309413-1
Heilind Number:AMP2309413-1
Manufacturer:TE Connectivity
Manufacturer Number:2309413-1
Datasheet:Application Specification
ECAD Model:
3D Model

Description:

DDR4 SODIMM 260P 9.2H STD

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Specifications

AttributeValue
Product Category:
Memory Sockets & Connectors DIMM & SIMM Memory Sockets
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2309413-1
Series:DDR4 DIMM
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Mount Type:Board Mount
Contact Material:Copper Alloy
Pitch:.0197 in, 5 mm, 7.3 mm
Voltage:1.2 V
Socket Type:Memory Card
Row Spacing:.322 in, 8.2 mm
Keying:Standard
Key Type:Offset Left
Latch Material:High Temperature Thermoplastic
Contact Amperage:.5 A
Number of Positions:260
Housing Color:Black
Profile:High
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Power
Contact Mating Area Plating:Gold Flash
PCB Retention:With
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Gold Flash
PCB Retention Type:Solder Peg
Sealable:No
Connector and Contact Terminate To:Printed Circuit Board
Connector System:Cable-to-Board
Stack Height:.362 in, 9.2 mm
Ejector Type:Locking
PCB Mounting Style:Surface Mount
Ejector Location:Both Ends
Center Key:Offset Left
Center Post:Without
DRAM Type:Small Outline (SO)
Insertion Style:Cam-In
Socket Style:SO DIMM
Module Orientation:Right Angle
Retention Post Location:Both Ends
Retention Post Material:Stainless Steel
Material Flammability Standard:UL 94V-0
Part Aliases:2309413-1
SKU:AMP2309413-1

Detailed Description

Enhance your system's memory performance with this DDR4 SODIMM 260P 9.2H STD module, featuring a high-quality construction for reliable operation. Designed for board mount installation, it boasts a durable housing made of high-temperature thermoplastic in a sleek black finish. With 260 positions and a .5mm pitch, this memory card offers efficient connectivity, while its gold flash plating ensures optimal signal transmission. Operating within a wide temperature range of -55 to 85°C, it is suitable for various environments. RoHS compliant and lead-free solder capable, this module aligns with modern environmental standards. Perfect for power circuit applications, it is ideal for use in a range of electronic devices.