Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 501193-7000 |
Series: | 501193 - Pico-Clasp |
Amperage: | 1.5 A |
Connector Type: | Pico-Clasp |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Phosphor Bronze |
Voltage: | 50 V AC/DC |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .1 µm |
Mating Cycles: | 30 |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 28 AWG, 30 AWG, 32 AWG |
Connector System: | Wire to Board, Wire to Wire |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .8 mm |
Part Aliases: | 5011937000 |
SKU: | MOL501193-7000 |
501193-7000
Heilind Number: | MOL501193-7000 |
Manufacturer: | Molex |
Manufacturer Number: | 501193-7000 |
Datasheet: | Product Specification |
ECAD Model: |
Description:
1.00mm Pitch, Pico-Clasp Female Crimp Terminal, Gold Plating 0.10µm, 28-32 AWG, Low-Halogen, Reel
More >>Specifications
Detailed Description
Introducing the Pico-Clasp Female Connector, a reliable solution for your signal transmission needs. With a durable construction and gold-plated contact mating area, this connector ensures optimal performance, even in high-cycling applications. Suitable for wire sizes ranging from 28 AWG to 32 AWG, it offers versatility in connectivity for both Wire to Wire and Wire to Board systems. The phosphor bronze contact material and tin termination plating guarantee efficient signal transfer, while RoHS compliance underscores our commitment to environmental responsibility. Whether you're designing a new circuit or upgrading an existing one, the Pico-Clasp Female Connector is a dependable choice for seamless connectivity.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
02/28/2025 | 515159 - Change Supplier, Manufacturing Process Change, Change to Product. This notification is to inform about expand metal supply sources, plating process, product design enhancement on spring contact, flash gold plating on back surface & additional pilot hole on carrier. No changes will be made to product as part of this change and only minor change on plating. | Download |