10-97-7046

Heilind Number:MOL10-97-7046
Manufacturer:Molex
Manufacturer Number:10-97-7046
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, 0.38

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 10-97-7046
Color:Black
Series:70280 - C-Grid
Amperage:3 A
Connector Type:C-Grid
Number of Contacts:4
Number of Rows:2
Termination Method:Through Hole
Contact Material:Copper Alloy
Body Orientation:Straight
Pitch:2.54 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Keying:No
Tail Length:2.79 mm
Packaging:Bag
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:4
Mating Cycles:50
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:2.032 µm
Polarized to Mate:No
PCB Thickness (Recommended):1.6 mm
Connector System:Board to Board, Wire to Board
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:No
Stackable:Yes
Breakaway:Yes
Make First / Break Last:No
Shroud Type:No
Material Flammability Standard:94V-0
Part Aliases:0010977046 A-70280-0162
SKU:MOL10-97-7046

Detailed Description

Easily connect your electronic components with this C-Grid connector. Featuring a straight, through-hole termination method and a pitch of 2.54mm, it ensures secure and reliable connections in your PCB assembly. With a contact material of Copper Alloy and gold plating in the mating area, it guarantees excellent conductivity. Its high-temperature thermoplastic body, operating range of -40 to 105°C, and UL certification ensure durability and safety. Suitable for board-to-board or wire-to-board applications, this connector with 4 contacts in 2 rows is stackable, breakaway, and lead-free process capable, making it a versatile choice for various electronic projects.