| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | JAE Electronics |
| Manufacturer Part Number: | JAE Electronics M34P75C4F2 |
| Series: | MX34 |
| Amperage: | 3 A |
| Contact Material: | Copper Alloy |
| Contact Plating: | Tin plating over Nickel |
| SKU: | JAEM34P75C4F2 |
M34P75C4F2
| Heilind Number: | JAEM34P75C4F2 |
| Manufacturer: | JAE Electronics |
| Manufacturer Number: | M34P75C4F2 |
| ECAD Model: | |
Description:
PIN CONTACT FOR MX34 HOUS
Specifications
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2025 | ENG-E25-059 - Stamp Die Replacement. Replacement Stamp Die To Keep Production Capacity | Download | |||
| 01/01/2025 | ENG-E24-136 - Replacement Stamp Die. 566265-001 to replace 562925-003 (when it reaches EOL) | Download | |||
| 07/31/2021 | ENG-E21-042 - Additional Stamp Die. Additional Stamp Die To Keep Product Capacity, Additional stamp die completion end of July 2021, Proposed PPAP Submissions end of september 2021, start of mass production as soon as receiving PPAP approvals from all customers | Download | |||
| 04/30/2020 | ENG-E20-001 - Process Change PPAP. Replacement stamp die Process change to PPAP and will only be prepared & provided to customer who already requested and received initial PPAP before. | Download | |||
| 08/31/2017 | ENG-E17-048 - Additional Stamp Die To Keep Production Capacity. | Download | |||
