Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2309413-1 |
Series: | DDR4 DIMM |
Housing Material: | High Temperature Thermoplastic |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Copper Alloy |
Pitch: | .0197 in, 5 mm, 7.3 mm |
Voltage: | 1.2 V |
Socket Type: | Memory Card |
Row Spacing: | .322 in, 8.2 mm |
Keying: | Standard |
Key Type: | Offset Left |
Latch Material: | High Temperature Thermoplastic |
Contact Amperage: | .5 A |
Number of Positions: | 260 |
Housing Color: | Black |
Profile: | High |
Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
Circuit Application: | Power |
Contact Mating Area Plating: | Gold Flash |
PCB Retention: | With |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Gold Flash |
PCB Retention Type: | Solder Peg |
Sealable: | No |
Connector and Contact Terminate To: | Printed Circuit Board |
Connector System: | Cable-to-Board |
Stack Height: | .362 in, 9.2 mm |
Ejector Type: | Locking |
PCB Mounting Style: | Surface Mount |
Ejector Location: | Both Ends |
Center Key: | Offset Left |
Center Post: | Without |
DRAM Type: | Small Outline (SO) |
Insertion Style: | Cam-In |
Socket Style: | SO DIMM |
Module Orientation: | Right Angle |
Retention Post Location: | Both Ends |
Retention Post Material: | Stainless Steel |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 2309413-1 |
SKU: | AMP2309413-1 |
2309413-1
Heilind Number: | AMP2309413-1 |
Manufacturer: | TE Connectivity |
Manufacturer Number: | 2309413-1 |
Datasheet: | Application Specification |
ECAD Model: |
Specifications
Detailed Description
Enhance your system's memory performance with this DDR4 SODIMM 260P 9.2H STD module, featuring a high-quality construction for reliable operation. Designed for board mount installation, it boasts a durable housing made of high-temperature thermoplastic in a sleek black finish. With 260 positions and a .5mm pitch, this memory card offers efficient connectivity, while its gold flash plating ensures optimal signal transmission. Operating within a wide temperature range of -55 to 85°C, it is suitable for various environments. RoHS compliant and lead-free solder capable, this module aligns with modern environmental standards. Perfect for power circuit applications, it is ideal for use in a range of electronic devices.
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