1-2007492-7

Heilind Number:AMP1-2007492-7
Manufacturer:TE Connectivity
Manufacturer Number:1-2007492-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+assy2x1 EMI Sprg Outer Lp Sn Enhance

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-2007492-7
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:2
Number of Positions:40
Data Rate:16 Gb/s
Port Matrix Configuration:2 x 1
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP1-2007492-7
Lightpipe Configuration:Single Triangular (Outer)
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:3 mm / .118 in
Cage Material:Nickel Silver
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
Pluggable I/O Applications:EMI Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:Yes
Cage Type:Stacked
Form Factor:SFP+

Detailed Description

Enhance signal integrity with our SFP+ Assembly featuring a 2x1 configuration and EMI spring outer loop design. This high-speed connector supports data rates up to 16 Gb/s, ensuring reliable performance in demanding applications. With 40 positions and through-hole press-fit termination, it guarantees secure PCB mounting. Operating seamlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), this RoHS-compliant assembly is a versatile choice for high-speed connectivity needs. Ideal for SFP/SFP+/zSFP+ applications, it combines a cage assembly with an integrated connector, offering convenience and efficiency in assembly. Elevate your connectivity solutions with this advanced component.