1-2007637-8

Heilind Number:AMP1-2007637-8
Manufacturer:TE Connectivity
Manufacturer Number:1-2007637-8
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ assy 2x2 EMI Spg No LP Enhanced

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-2007637-8
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:4
Number of Positions:80
Data Rate:16 Gb/s
Port Matrix Configuration:2 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP1-2007637-8
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:3 mm / .118 in
Cage Material:Nickel Silver
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
Pluggable I/O Applications:EMI Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Cage Type:Stacked
Form Factor:SFP+

Detailed Description

Upgrade your networking setup with our high-performance SFP+ assembly featuring a 2x2 EMI configuration. Designed for seamless integration, this assembly offers enhanced signal integrity with no LP, perfect for demanding applications. With a data rate of 16 Gb/s, it ensures fast and reliable connectivity. Operating within a wide temperature range from -55 to 105°C, this assembly is built to withstand harsh environments. Its Through Hole - Press-Fit termination method and 80 positions make installation a breeze. Trust in its RoHS compliance and quality assurance for a dependable solution in high-speed networking environments.