1-2149490-5

Heilind Number:AMP1-2149490-5
Manufacturer:TE Connectivity
Manufacturer Number:1-2149490-5
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Assy 2x8 EMI Spg 4 Lp Sn Enhanced

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-2149490-5
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:16
Number of Positions:320
Data Rate:16 Gb/s
Port Matrix Configuration:2 x 8
Operating Temperature Range:-55 - 105 °C, -65 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP1-2149490-5
Lightpipe Configuration:Four Triangular (Inner & Outer)
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:3 mm / .118 in
Cage Material:Nickel Silver
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
Pluggable I/O Applications:EMI Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:Yes
Cage Type:Stacked
Form Factor:SFP+

Detailed Description

Enhance your network connectivity with the SFP+ Assy 2x8 EMI Spg 4 Lp Sn Enhanced. This high-performance assembly features a compact design with 16 ports and 320 positions, making it ideal for demanding data transfer applications. With a data rate of 16 Gb/s and operating temperature range of -55 to 105°C, it ensures reliable performance in extreme environments. The Through Hole - Press-Fit termination method offers secure and efficient PCB mounting, while RoHS compliance guarantees environmental responsibility. Suitable for SFP/SFP+/zSFP+ applications, this Cage Assembly with Integrated Connector is a versatile solution for high-speed connectivity needs.