2007538-6

AMP2007538-6
Heilind Number:AMP2007538-6
Manufacturer:TE Connectivity
Manufacturer Number:2007538-6
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+assy2x1 Gasket Inner Lp Sn

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007538-6
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:2
Number of Positions:40
Data Rate:16 Gb/s
Port Matrix Configuration:2 x 1
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP2007538-6
Lightpipe Configuration:Single Triangular (Inner)
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:3 mm / .118 in
Cage Material:Nickel Silver
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
Pluggable I/O Applications:SFP+
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:Yes
Cage Type:Stacked
Form Factor:SFP+

Detailed Description

Enhance your high-speed connectivity with the SFP+assy2x1 Gasket Inner Lp Sn, a cutting-edge solution for data transmission. This assembly features a Through Hole - Press-Fit termination method, ensuring secure and reliable connections. With a pitch of .8mm (.032 in) and 40 positions, it supports high-speed data rates of up to 16 Gb/s. Operating seamlessly in temperatures ranging from -55 to 105°C (-67 to 221°F), it is ideal for demanding environments. Designed for PCB mounting, this Cage Assembly with Integrated Connector is RoHS compliant, guaranteeing its environmental sustainability. Explore the future of connectivity with this essential component.