2007562-6

Heilind Number:AMP2007562-6
Manufacturer:TE Connectivity
Manufacturer Number:2007562-6
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ assy 2x6 Spring Fingers inner Lp Sn

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007562-6
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:12
Number of Positions:240
Data Rate:16 Gb/s
Port Matrix Configuration:2 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP2007562-6
Lightpipe Configuration:Single Triangular (Inner)
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:3 mm / .118 in
Cage Material:Nickel Silver
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
Pluggable I/O Applications:SFP+
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:Yes
Cage Type:Stacked
Form Factor:SFP+

Detailed Description

Enhance your high-speed connectivity with our SFP+ assembly featuring 2x6 Spring Fingers for reliable performance. This Low Profile version ensures a seamless fit, while the Through Hole - Press-Fit termination method guarantees secure installation. With a pitch of .8mm (.032 in) and data rate of 16 Gb/s, this assembly is designed for optimal speed and efficiency. Operating in a wide temperature range from -55 to 105°C (-67 to 221°F), it offers versatility for various environments. Perfect for demanding applications, this Cage Assembly with Integrated Connector is RoHS compliant, meeting international standards for environmental responsibility. Elevate your connectivity solutions with this high-performance component.