2170190-2

AMP2170190-2
Heilind Number:AMP2170190-2
Manufacturer:TE Connectivity
Manufacturer Number:2170190-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, W/ High Heatsink

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170190-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2170190-2
Heat Sink Style:Pin
Heat Sink Height:10.5 mm / .413 in
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your network connectivity with our SFP+ Cage Assembly, featuring a high heatsink for optimal performance. With a 1x2 port matrix configuration, this assembly supports data rates of up to 16 Gb/s, ensuring seamless high-speed transmission. Designed for durability, it is RoHS compliant and operates efficiently in a wide temperature range from -55 to 105°C (-67 to 221°F). The Through Hole - Press-Fit termination method allows for secure PCB mounting, making it ideal for various applications in high-speed connectivity. Elevate your networking infrastructure with this reliable and high-performance component.