2170191-1

Heilind Number:AMP2170191-1
Manufacturer:TE Connectivity
Manufacturer Number:2170191-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4 , W/ Low Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170191-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2170191-1
Heat Sink Style:Pin
Heat Sink Height:3.3 mm / .13 in
Heat Sink Height Class:Custom
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Experience enhanced connectivity with our SFP+ 1x4 assembly, featuring a low-profile heatsink for optimal performance. With a data rate of 16 Gb/s and a port matrix configuration of 1 x 4, this component ensures seamless high-speed transmission. Designed for reliability in a wide operating temperature range of -55 to 105°C (-67 to 221°F), it offers durability in various environments. The through-hole press-fit termination method guarantees secure and stable mounting on your PCB. RoHS compliant, this cage assembly is the perfect choice for your high-speed connectivity needs.