2170191-1

Heilind Number:AMP2170191-1
Manufacturer:TE Connectivity
Manufacturer Number:2170191-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4 , W/ Low Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170191-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2170191-1

Detailed Description

Experience enhanced connectivity with our SFP+ 1x4 assembly, featuring a low-profile heatsink for optimal performance. With a data rate of 16 Gb/s and a port matrix configuration of 1 x 4, this component ensures seamless high-speed transmission. Designed for reliability in a wide operating temperature range of -55 to 105°C (-67 to 221°F), it offers durability in various environments. The through-hole press-fit termination method guarantees secure and stable mounting on your PCB. RoHS compliant, this cage assembly is the perfect choice for your high-speed connectivity needs.