| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2170705-1 |
| Series: | zQSFP+/QSFP28 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Number of Ports: | 1 |
| Data Interface: | QSFP28/56 |
| Data Rate: | 28 Gb/s |
| Application: | Standard |
| GPL: | J25 |
| Port Matrix Configuration: | 1 x 1 |
| Tail Length: | .081 in, 2.05 mm |
| Packaging: | Box & Tray |
| Operating Temperature Range: | -40 - 185 °F, -40 - 85 °C |
| Circuit Application: | Signal |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .062 in, 1.57 mm |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | X260 |
| EMI and RFI Protection Type: | Internal/External EMI Springs |
| Connector System: | Cable-to-Board |
| Connector Product Type: | Cage Assembly |
| ECCN: | EAR99 |
| Heat Sink Style: | Pin |
| Cage Type: | Single |
| Heat Sink Finish: | Anodized Black |
| Heat Sink Height Class: | PCI |
| Heat Sink Height: | .165 in, 4.2 mm |
| Lightpipe Configuraton: | Single Round |
| Rear EONs Per Port Column: | 2 |
| Cage Material: | Nickel Silver |
| Lightpipe Included: | Yes |
| Enhancements: | Standard |
| Included Accessory: | Heat Sink |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2170705-1 |
| SKU: | AMP2170705-1 |
2170705-1
Specifications
Detailed Description
Enhance your data transmission capabilities with this high-performance CAGE ASSY, featuring a QSFP28 1x1 interface. Designed for board mount installation using Through Hole - Press-Fit termination, this assembly ensures secure and reliable connectivity in demanding environments. With UL 94V-0 material flammability standard compliance, it guarantees safety and durability. Operating within a wide temperature range of -40 to 85°C, it is suitable for various applications. Its single port matrix configuration, along with a data rate of 28 Gb/s, meets high-speed connectivity requirements. Incorporating internal/external EMI springs, it provides effective EMI and RFI protection. Complete with a heat sink for efficient thermal management, this assembly is an essential component for signal integrity in electronic systems.

