2198224-3

Heilind Number:AMP2198224-3
Manufacturer:TE Connectivity
Manufacturer Number:2198224-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, Networking Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198224-3
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198224-3
Heat Sink Style:Pin
Heat Sink Height:9.1 mm / .358 in
Heat Sink Height Class:Short
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your networking capabilities with our SFP+ 1x2 Cage Assembly, featuring a durable Networking Heatsink for optimal performance. With a data rate of 16 Gb/s and a port matrix configuration of 1 x 2, this assembly is designed to meet high-speed connectivity demands. Operating seamlessly in temperatures ranging from -55 to 105°C (-67 to 221°F), it's reliable in diverse environments. The Through Hole - Press-Fit termination method ensures secure installation on your PCB. RoHS compliant and part of our SFP/SFP+/zSFP+ product line, it guarantees quality and sustainability. Upgrade your high-speed connections with this essential component.