2198225-3

AMP2198225-3
Heilind Number:AMP2198225-3
Manufacturer:TE Connectivity
Manufacturer Number:2198225-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, Net Heatsink, LP

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198225-3
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198225-3
Heat Sink Style:Pin
Heat Sink Height:9.1 mm / .358 in
Heat Sink Height Class:Short
Lightpipe Style:Reduced Length
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Elevate your network connectivity with our SFP+ Enhanced 1x2 Cage Assembly. Designed for high-speed performance, this assembly features a Net Heatsink and LP form factor, making it ideal for demanding applications. With a data rate of 16 Gb/s and a port matrix configuration of 1 x 2, it ensures efficient data transmission. Operating seamlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), it guarantees reliability in diverse environments. Its Through Hole - Press-Fit mounting style offers secure installation, while its RoHS compliance underscores our commitment to environmental responsibility. Perfect for SFP/SFP+/zSFP+ applications, this assembly is a must-have for your connectivity needs.