Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2198226-2 |
Termination Method: | Through Hole - Press-Fit |
Number of Ports: | 2 |
Data Rate: | 16 Gb/s |
Port Matrix Configuration: | 1 x 2 |
Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
PCB Mounting Style: | Through Hole - Press-Fit |
Product: | SFP/SFP+/zSFP+ |
Product Type: | Cage Assembly |
SKU: | AMP2198226-2 |
Heat Sink Style: | Pin |
Heat Sink Height: | 6.5 mm / .256 in |
Heat Sink Height Class: | SAN |
Lightpipe Style: | Reduced Length |
Lightpipe Configuration: | Dual Round |
Lightpipe Profile: | Standard |
PCB Thickness (Recommended): | 1.5 mm / .059 in |
Tail Length: | 2.05 mm / .081 in |
Cage Material: | Nickel Silver |
Connector Mounting Type: | Board Mount |
Circuit Application: | Signal |
Heat Sink Compatible: | Yes |
For Use With Pluggable I/O Products: | SFP+ SMT Connector |
Pluggable I/O Applications: | SFP+ Enhanced |
Included Lightpipe: | Yes |
EMI Containment Feature Type: | Elastomeric Gasket |
Connector and Contact Terminates To: | Printed Circuit Board |
Connector System: | Cable-to-Board |
Sealable: | Yes |
Integrated Lightpipes: | No |
Thermal Accessory Type Included: | Heat Sink |
Cage Type: | Ganged |
Form Factor: | SFP+ |
2198226-2
Specifications
Detailed Description
Enhance your SAN setup with our SFP+ 1x2 Cage Assembly, designed for optimal performance in high-speed networking environments. This Low Profile (LP) assembly features a SAN Heatsink for efficient heat dissipation, ensuring reliable operation even in demanding conditions. With two ports supporting a data rate of 16 Gb/s each, it offers seamless connectivity for your network infrastructure. The Through Hole - Press-Fit termination method guarantees secure attachment to the PCB, while the wide operating temperature range of -55 to 105 °C (-67 to 221 °F) ensures versatility in deployment. RoHS compliant and part of our SFP/SFP+/zSFP+ product line, this assembly is a quality choice for connectivity solutions.