2198226-2

Heilind Number:AMP2198226-2
Manufacturer:TE Connectivity
Manufacturer Number:2198226-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, SAN Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198226-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198226-2

Detailed Description

Enhance your SAN setup with our SFP+ 1x2 Cage Assembly, designed for optimal performance in high-speed networking environments. This Low Profile (LP) assembly features a SAN Heatsink for efficient heat dissipation, ensuring reliable operation even in demanding conditions. With two ports supporting a data rate of 16 Gb/s each, it offers seamless connectivity for your network infrastructure. The Through Hole - Press-Fit termination method guarantees secure attachment to the PCB, while the wide operating temperature range of -55 to 105 °C (-67 to 221 °F) ensures versatility in deployment. RoHS compliant and part of our SFP/SFP+/zSFP+ product line, this assembly is a quality choice for connectivity solutions.