2198227-2

AMP2198227-2
Heilind Number:AMP2198227-2
Manufacturer:TE Connectivity
Manufacturer Number:2198227-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x6, SAN Heatsink

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198227-2
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198227-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:PCI
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your SAN setup with our SFP+ 1x6 Cage Assembly, designed for high-speed connectivity in data centers. This rugged assembly features a SAN heatsink for optimal performance, with Through Hole - Press-Fit termination ensuring secure mounting. With six ports offering a data rate of 16 Gb/s each, it's perfect for demanding applications. Operating in a wide temperature range of -55 to 105 °C (-67 to 221 °F), this RoHS-compliant assembly guarantees reliability in any environment. Upgrade your system with this essential component for seamless connectivity.