2198229-1

Heilind Number:AMP2198229-1
Manufacturer:TE Connectivity
Manufacturer Number:2198229-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x6, PCI Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198229-1
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198229-1
Heat Sink Style:Pin
Heat Sink Height:4.2 mm / .165 in
Heat Sink Height Class:PCI
Lightpipe Style:Standard
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your high-speed connectivity with our SFP+ 1x6 Cage Assembly, featuring a PCI Heatsink for optimal performance in a low-profile design. With Through Hole - Press-Fit termination method and a data rate of 16 Gb/s, this assembly is perfect for demanding applications. Its rugged construction and wide operating temperature range make it suitable for harsh environments. ROHS compliant and designed for reliability, it is a must-have for your high-speed connectivity needs.