2198231-2

Heilind Number:AMP2198231-2
Manufacturer:TE Connectivity
Manufacturer Number:2198231-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, SAN Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198231-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198231-2

Detailed Description

Upgrade your SAN system with the SFP+ Enhanced 1x2 Cage Assembly, designed for high-speed connectivity in demanding environments. With a low-profile SAN heatsink and Through Hole - Press-Fit termination method, this assembly ensures secure and efficient data transfer. Featuring two ports with a data rate of 16 Gb/s, it's perfect for high-performance networking. Operating flawlessly in temperatures ranging from -55 to 105°C (-67 to 221°F), this RoHS-compliant assembly guarantees reliable performance. Elevate your connectivity with this essential component for IO connectors in your system.