2198235-2

Heilind Number:AMP2198235-2
Manufacturer:TE Connectivity
Manufacturer Number:2198235-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x6, SAN Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198235-2
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198235-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Experience high-speed connectivity with our SFP+ Enhanced 1x6 Cage Assembly. Designed for seamless integration in SAN environments, this assembly features a rugged SAN Heatsink for optimal performance. With a data rate of 16 Gb/s, it ensures reliable transmission speeds, while the 1 x 6 port matrix configuration offers versatile connectivity options. Operating efficiently in temperatures ranging from -55 to 105°C (-67 to 221°F), this assembly is built for durability. With RoHS compliance, you can trust in its environmental responsibility. Ideal for demanding applications, this assembly is a must-have for high-speed connectivity needs.