2198241-1

Heilind Number:AMP2198241-1
Manufacturer:TE Connectivity
Manufacturer Number:2198241-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, PCI Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198241-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198241-1
Heat Sink Style:Pin
Heat Sink Height:4.2 mm / .165 in
Heat Sink Height Class:PCI
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your connectivity with our SFP+ Cage Assembly, featuring a PCI heatsink for optimal performance. With a 1x4 port matrix configuration, this high-speed connector supports data rates of up to 16 Gb/s, ensuring seamless transmission. Designed for durability, it can withstand operating temperatures ranging from -55°C to 105°C (-67°F to 221°F). RoHS compliant and featuring a Through Hole - Press-Fit termination method, it guarantees a secure and environmentally friendly connection. Perfect for demanding applications, this assembly is a reliable choice for your connectivity needs.