2198242-2

Heilind Number:AMP2198242-2
Manufacturer:TE Connectivity
Manufacturer Number:2198242-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, SAN Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198242-2
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198242-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
Lightpipe Style:Reduced Length
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Enhance your SAN connectivity with our SFP+ Cage Assembly, featuring a 1x4 port matrix configuration for efficient data transfer at 16 Gb/s. Designed for high-speed performance, this low-profile assembly is equipped with a SAN heatsink for optimal thermal management in demanding environments. With through-hole press-fit termination, it ensures secure and reliable PCB mounting. Operating seamlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), it meets RoHS compliance standards for environmental responsibility. Elevate your network infrastructure with this essential component, ideal for professional IT setups.