2198318-7

Heilind Number:AMP2198318-7
Manufacturer:TE Connectivity
Manufacturer Number:2198318-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

zSFP+ STACKED 2X1 RECEPTACLE ASSEMBLY

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198318-7
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:2
Number of Positions:40
Data Rate:32 Gb/s
Port Matrix Configuration:2 x 1
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly with Integrated Connector
SKU:AMP2198318-7
Lightpipe Style:Standard
Lightpipe Configuration:Dual Triangular (Inner)
Contact Mating Area Plating Material:Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Thickness:.76 µm / 29.92 µin
Tail Plating Material:Tin
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:1.8 mm / .07 in
Cage Material:Nickel Silver Alloy
UL Flammability Rating:UL 94V-0
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:No
For Use With Pluggable I/O Products:zSFP+ SMT Connector
Pluggable I/O Applications:zSFP+ Thermally Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:Yes
Cage Type:Stacked
Form Factor:zSFP+ Stacked (SFP28)

Detailed Description

Enhance high-speed data transmission with our zSFP+ STACKED 2X1 RECEPTACLE ASSEMBLY. This cutting-edge connector features a pitch of .8mm (.032 in) and is designed for Through Hole - Press-Fit termination. With two ports and 40 positions, it offers seamless connectivity for 32 Gb/s data rates. Operating effortlessly in a wide temperature range from -55 to 105 °C (-67 to 221 °F), this assembly is ideal for demanding environments. RoHS compliant and part of our SFP/SFP+/zSFP+ product line, it guarantees both performance and environmental responsibility. Upgrade your high-speed applications with this essential component.