2288219-3

Enhance cooling efficiency for your CFP2 modules with this high-performance heatsink designed for side-to-side airflow. Ideal for data rates up to 25 Gb/s, it features a durable anodized finish and is compatible with 3mm PCB thickness. The sleek design, with a height of .38 inches, ensures optimal heat dissipation, meeting RoHS compliance for environmental responsibility. Packaged in a convenient tray, this accessory, part of our Data and Devices lineup, guarantees reliable performance in high-speed connectivity applications. Elevate your system's thermal management with the L322 heatsink, a must-have for ensuring seamless operation in demanding environments.