171335-1807

Heilind Number:MOL171335-1807
Manufacturer:Molex
Manufacturer Number:171335-1807
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Impel 92 Ohm, 3 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 8 Columns, 48 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171335-1807
Color:Black
Series:171335 - Impel
Amperage:.75 A
Connector Type:Impel
Number of Contacts:48
Number of Rows:6
Contact Material:High Performance Alloy (HPA)
Contact Plating:Gold
Maximum Operating Temperature:85 °C
Minimum Operating Temperature:-55 °C
Pitch:1.9 mm
Voltage:150 V AC/DC
Shield Type:Full Shield
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:92 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:3-pair
Data Rate:40 Gb/s
Tail Length:1.3 mm
Packaging:Tray
Operating Temperature Range:-55 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:48
Mating Cycles:200
PCB Locator:No
PCB Retention:Without
PCB Thickness (Recommended):1 mm
Number of Columns:8
UL Agency Certification:E29179
Contact Termination Plating:Nickel, Tin
Termination Pitch:1.9 mm
Guide to Mating Part:No
Board to Board Configuration:Backplane
Make First / Break Last:No
Part Aliases:1713351807
SKU:MOL171335-1807

Detailed Description

Upgrade your backplane connectivity with the Impel 92 Ohm, 3 Pair Vertical Backplane Header. Designed for high-speed data transmission, this header features a 1.90mm pitch and 48 gold-plated contacts for reliable performance. With a maximum operating temperature of 85°C and impedance of 92Ω, it ensures optimal signal integrity. The high-performance alloy contact material and full shield construction guarantee durability in demanding environments. Perfect for PCB applications, this header is RoHS compliant and offers a secure, unguided connection with open endwalls. Elevate your system's connectivity with this essential component.