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TE Connectivity (TE) ELCON Micro Power Connectors

TE Connectivity’s (TE) ELCON Micro wire-to-board power connectors provide a high current at 12.5A per pin in the common industry footprint of 3.0mm. This high current density in a compact design is useful for servers, switches, storage devices and testing machines. A common industry footprint also allows for easy upgrades to existing designs.

Features & Benefits

  • High current density at 12.5A per pin maximum in the common industry footprint of 3.0mm (contact pitch)
  • Common industry footprint allows for easy upgrades to existing designs
  • Support 2 to 24 pin configurations and different currents with multiple combinations of different wire sizes
  • ELCON Micro headers are PCB footprint compatible with other suppliers
  • Easy assembly with virtually fool-proof mating features
  • Perform reliably in harsh environments with maximum operating temperature of 105oC


  • Computer / Datacom / Telecommunications


Servers, switches, storage devices, battery testing machines, business retail equipment (BRE)

Product Spec Sheets and Additional Information

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