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TE Connectivity (TE) ELCON Micro Power Connectors

TE Connectivity’s (TE) ELCON Micro wire-to-board power connectors provide a high current at 12.5A per pin in the common industry footprint of 3.0mm. This high current density in a compact design is useful for servers, switches, storage devices and testing machines. A common industry footprint also allows for easy upgrades to existing designs.

Features & Benefits

  • High current density at 12.5A per pin maximum in the common industry footprint of 3.0mm (contact pitch)
  • Common industry footprint allows for easy upgrades to existing designs
  • Support 2 to 24 pin configurations and different currents with multiple combinations of different wire sizes
  • ELCON Micro headers are PCB footprint compatible with other suppliers
  • Easy assembly with virtually fool-proof mating features
  • Perform reliably in harsh environments with maximum operating temperature of 105oC

Industries

  • Computer / Datacom / Telecommunications

Applications

Servers, switches, storage devices, battery testing machines, business retail equipment (BRE)

Product Spec Sheets and Additional Information


Request More Information & Samples


1-2204801-8 TE CNTY AMP HEADER,3MM,VERT,4P DUAL ROW ELCON MICRO, WTB
1 …  0.95772E
200 …  0.82713E
500 …  0.8028 E
950 …  0.77986E
1,850 …  0.77986E
9,200 …  0.71943E

3-2204801-8 TE CNTY AMP HEADER,3MM,VERT,8P DUAL ROW ELCON MICRO, WTB
1 …  1.32166E
150 …  1.14143E
350 …  1.10786E
700 …  1.07621E
1,350 …  1.07621E
6,650 …  0.99281E

7-2204801-8 TE CNTY AMP HEADER,3MM,VERT,16P DUAL ROW ELCON MICRO, WTB
1 …  2.1453 E
90 …  1.85276E
210 …  1.79826E
410 …  1.74688E
820 …  1.74688E
4,090 …  1.72228E

 


 

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