Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 59370-8000 |
Series: | 59370 - MicroTPA - MUO 2.5 |
Connector Type: | MicroTPA, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Phosphor Bronze |
Contact Plating: | Tin |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.5 mm |
Part Aliases: | 0593708000 |
SKU: | MOL59370-8000 |
59370-8000
Heilind Number: | MOL59370-8000 |
Manufacturer: | Molex |
Manufacturer Number: | 59370-8000 |
Datasheet: | 3D Drawing |
ECAD Model: |
Specifications
Detailed Description
Enhance your signal connections with our MicroTPA - MUO 2.5 Female Connector, meticulously designed for optimal performance. Crafted with Phosphor Bronze contacts and Tin plating, it ensures reliable conductivity. Suitable for wire sizes ranging from 24 to 28 AWG, it offers versatility in various applications. Whether you prefer crimp or compression termination methods, this connector guarantees a secure fit. RoHS compliant and packaged on a reel, it meets industry standards for environmental responsibility and ease of use. Elevate your wire-to-board connections with this essential component.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
09/15/2016 | 501416 - Equipment Transfer, Production Transfer or Rearrangement. | Download |