Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 59370-8100 |
Series: | 59370 - MicroTPA - MUO 2.5 |
Connector Type: | MicroTPA, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Phosphor Bronze |
Contact Plating: | Tin |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.5 mm |
Part Aliases: | 0593708100 |
SKU: | MOL59370-8100 |
59370-8100
Heilind Number: | MOL59370-8100 |
Manufacturer: | Molex |
Manufacturer Number: | 59370-8100 |
Datasheet: | Product Specification |
ECAD Model: |
Specifications
Detailed Description
Enhance your connectivity with our MicroTPA - MUO 2.5 Female Connector, designed for seamless integration in compact spaces. Crafted with precision, it ensures reliable signal transmission through crimp or compression termination methods. The Phosphor Bronze contacts with Tin plating guarantee optimal conductivity, while the sturdy construction accommodates wire sizes ranging from 24 to 28 AWG. RoHS compliant and featuring a tin-plated termination, this connector is ideal for various circuit applications. Trust in its performance for efficient wire-to-board connections in your projects.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
09/15/2016 | 501416 - Equipment Transfer, Production Transfer or Rearrangement. | Download |