205206-9

Heilind Number:AMP205206-9
Manufacturer:TE Connectivity
Manufacturer Number:205206-9
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

CRIMP SNAP PLUG ASSY,SIZE 2

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 205206-9
Gender:Plug
Number of Contacts:15
Pitch:.108 in, 2.74 mm
Shell Size:2
Contact Size:20
Shell Plating:Zinc
Insert Material:Thermoplastic
Package Quantity:400
Number of Positions:15
GPL:035
Shield Material:Steel
Shell Material:Steel
Packaging:Package
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Signal
Shielded:Yes
Sealable:No
Mating Connector Lock Type:Mounting Holes
GPL Description:Data and Devices
Connector and Contact Terminate To:Wire & Cable
Product Code:5091
Product Grade:Standard
Connector System:Cable-to-Cable
Connector Product Type:Connector
ECCN:EAR99
Mating Connector Lock:With
Grounding Indents:Without
Shell Type:Full Metal Shell
Insert Flammability Standard:UL 94V-0
Standards Met:UL 94V-0
Material Flammability Standard:UL 94V-0
Part Aliases:205206-9
Replacement Part:205206-8
SKU:AMP205206-9

Detailed Description

Introducing the Crimp Snap Plug Assembly, Size 2, a crucial component for your connectivity needs. This assembly, designed to meet UL 94V-0 standards, features a durable shell made of zinc-plated steel, ensuring reliable performance. With 15 contacts and a 2.74mm pitch, it's ideal for signal transmission in various applications. The thermoplastic insert material provides both strength and insulation, while the steel shield offers added protection. Operating within a wide temperature range of -55 to 105°C (-67 to 221°F), this connector is suitable for diverse environments. Whether for data transfer or device connectivity, this assembly, part of our Cable-to-Cable connector system, guarantees secure and efficient linkages. RoHS compliant and with insert flammability rating UL 94V-0, it meets stringent quality and safety standards. Trust in its performance for your projects in electronics, telecommunications, and beyond.