| Effective Date | Description of Change | Download |
|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.
| Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download |
| 07/17/2023 | P-23-024381 - Product Improvement. Adding a new mold cavity for the organizer. Increase production and reduce the lead time. No Form, Fit, and Function on the affected parts below.
| Download |
| 03/31/2023 | P-22-023825 - Product Change. Increase the width of the wafer slots on the housing(Shroud) by 0.09mm in order to reduce the risk of FOD (Foreign Object Debris) that can be generated by insertion of the PWB wafers during parts assembly
| Download |
| 09/07/2022 | P-22-023007 - Additional Vendor. Press Fit contacts used on the listed Multigig connectors are currently stamped and plated at Outside Vendors. An additional Outside vendor has been qualified for the Plating process. There are no changes to the specifications for the part or other plating changes. This change is specifically focused on having a new plating source for an existing design. | Download |
| 04/17/2017 | P-17-014050 - Manufacturing location change. Following Part Numbers will be transferred from outside supplier to TE Connectivity manufacturing location in Mt.Joy, Pennsylvania. | Download |
| 05/30/2014 | E-14-007078 - Product Improvement. The EYE OF NEEDLE Tin-Lead Plating change from Sn93-Pb7 To Sn60-Pb40 for TE parts 1410186-3, 1410187-5, 1410189-5, 1410140-3, 1410142-3. There is nothing change on these parts 1410140-1, 1410140-2, 1410142-1, 1410186-1, 1410187-1, 1410187-3, 1410189-3, 1410189-4. | Download |
