2102870-1
DC, 7Row, Right End, MULTIGIG RT 2R
The MULTIGIG RT 2-R Series, featuring a 7-row, right-end board-to-board connector designed for high-performance applications. With a current rating of .75 A, this plug connector offers reliable power and signal transmission. Featuring a pitch of 1.9 mm (.075 in) and 112 positions, it allows for secure and efficient board mounting. Operating in a wide temperature range from -55°C to 125°C (-67°F to 257°F), it is suitable for aerospace, defense, and marine environments. The right-angle mount orientation and fully shrouded design ensure proper alignment and protection. This connector is an essential component for backplane and PCB interconnects, meeting stringent quality standards for performance and durability.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102870-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | .75 A |
| Gender: | Plug |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .071 mm, 1.8 mm |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | J543 |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Right |
| Part Aliases: | 2102870-1 |
| SKU: | AMP2102870-1 |
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Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |