1410971-3
MULTIGIG RT T2 7RW H-LFT RTM
Experience seamless connectivity with the MULTIGIG RT T2 7RW H-LFT RTM, a high-performance board-to-board connector designed for power and signal applications in demanding environments. With a rugged construction and operating temperature range of -55 to 105°C (-67 to 221°F), this connector is ideal for aerospace, defense, and marine industries. Featuring a right-angle body orientation, it ensures efficient PCB mounting, while its 56 contacts in 7 rows provide ample connectivity options. The fully shrouded design and polarization feature guarantee secure mating alignment. Trust in the reliability of this connector for critical electronic systems.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1410971-3 |
| Series: | MULTIGIG RT 2 |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 56 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 8 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Left |
| Part Aliases: | 1410971-3 |
| SKU: | AMP1410971-3 |
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Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |
| 11/10/2022 | P-22-023166 - Product improvement. Increase width of the wafer slots on the housing by 0.09mm in order to reduce the risk of FOD (Foreign Object debris) that can be generated by insertion of the wafers during part assembly. | Download |