2102771-1
DC, 7Row, Center, MULTIGIG RT 2R
Experience high-speed connectivity with our DC MULTIGIG RT 2R connector, designed for demanding aerospace, defense, and marine applications. This board-to-board connector features a robust construction with 112 contacts arranged in 7 rows, ensuring reliable power and signal transmission. With a pitch of 1.9mm and right-angle orientation, it offers efficient PCB mounting in tight spaces. Operating in a wide temperature range from -55 to 105°C, this connector is built to withstand harsh environmental conditions. The fully shrouded design and center guide alignment provide added protection and ease of mating, making it ideal for mission-critical systems. Trust in the performance and quality of our MULTIGIG RT 2R connector for your connectivity needs.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102771-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 112 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Center |
| Part Aliases: | 2102771-1 |
| SKU: | AMP2102771-1 |
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Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |
| 03/02/2022 | P-21-021955 - Product improvement.To increase capacity and provide alternative manufacturing options for risk management. You are hereby informed that this second manufacturing line will be introduced on/or around March 1st , 2022. This line will follow the same strict procedure which fully maintains quality, ability to supply, and form-fit-function of the concerned products. New Manufacturing process will operate under the same certified quality management system. | Download |