Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 5-104363-2 |
Series: | AMPMODU MTE |
Amperage: | 3 A |
Housing Material: | Thermoplastic |
Number of Contacts: | 3 |
Number of Rows: | 1 |
Termination Method: | Crimp, Insulation Displacement Crimp (IDC), Through Hole (SMT Compatible) |
Contact Material: | Brass |
Pitch: | .1 in, 2.54 mm |
Contact Type: | Pin |
Strain Relief: | No Strain Relief |
Row Spacing: | .1 in, 2.54 mm |
Contact Amperage: | 3 A |
Number of Positions: | 3 |
Housing Color: | Black |
Mount Orientation: | Vertical |
Insulation Resistance: | 5000 MΩ |
Operating Temperature Range: | -65 - 105 °C |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 15 µin |
Panel Mount: | Without |
PCB Retention: | Without |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | .062 in, 1.57 mm |
Connector Height: | 13.59 mm, .535 in |
Connector and Contact Terminate To: | Printed Circuit Board |
Dielectric Withstanding Voltage: | 600 V |
Termination Resistance: | 15 mΩ |
Contact Shape: | Square |
PCB Contact Termination Area Plating Finish: | Matte |
Mating Retention: | With |
PCB Mount Alignment: | Without |
Termination Post Tail Length: | .13 in, 3.3 mm |
Header Type: | Shrouded |
Connector Assembly Type: | PCB Mount Header |
PCB Contact Termination Area Plating Thickness: | 100 - 200 µin, 2.54 - 5.08 µm |
Contact Mating Area Length: | .23 in, 5.84 mm |
Contact Retention: | With |
Contact Retention Type in Housing: | Locking Lance |
Temperature Rating: | High |
Standards Met: | UL E28476 CSA LR7189 |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5-104363-2 |
SKU: | AMP5-104363-2 |
5-104363-2
Specifications
Detailed Description
Introducing our AMPMODU MTE Series PCB Pin Header, designed for high-performance signal connectivity in industrial applications. With a housing made of UL 94V-0 rated thermoplastic and gold-plated brass contacts, this connector ensures reliable operation in demanding environments. Featuring a pitch of 2.54mm (.1 in) and a vertical mount orientation, it offers easy PCB integration. The connector is rated for 3A current and 600V dielectric withstanding voltage, meeting UL E28476 and CSA LR7189 standards for safety and performance. With 3 positions and IDC or crimp termination options, it provides versatility in assembly. The contact's square shape and 15µin gold plating guarantee optimal conductivity, while the housing's black color and 52-piece packaging make it easy to identify and handle. Whether for prototype development or mass production, this PCB pin header is the ideal choice for your connectivity needs. RoHS compliant.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
10/03/2022 | P-22-022599 - Manufacturing location change. Following Part Numbers will be transferred from TE Connectivity manufacturing location based in Roedermark, Germany to the TE Connectivity manufacturing location based in Tangiers, Morocco | Download | |||
07/31/2022 | P-22-022081 - Manufacturing location change. he planned movement of the MTE assemblies from last year, was delayed until this year. Manufacturing location change. In order to better align TE's manufacturing footprint to customer region of consumption, one of the assembly machines that make the AMPMODU MTE Assemblies, will be moved from the Hermosillo, Senora, Mexico plant to our Suzhou, China plant. For customers who are ordering the following AMPMODU MTE assemblies, with final consumption in the Europe or Asia-Pacific countries, the manufacturing location will change from our Hermosillo, Senora, Mexico plant to our Suzhou, China plant. These orders will be fulfilled by our Suzhou, China Plant. For all other customers whose final consumption is in the remaining global regions, and who order the following AMPMODU MTE assemblies, the manufacturing location will remain in our Hermosillo, Senora, Mexico plant. There will be no change to these customers. | Download | |||
12/13/2021 | P-21-020887 - Manufacturing location change. In order to better align TE s manufacturing footprint to customer region of consumption, one of the assembly machines that make the AMPMODU MTE Assemblies, will be moved from the Hermosillo, Senora, Mexico plant to our Suzhou, China plant. For customers who are ordering the following AMPMODU MTE assemblies, with final consumption in the Europe or Asia-Pacific countries, the manufacturing location will change from our Hermosillo, Senora, Mexico plant to our Suzhou, China plant. These orders will be fulfilled by our Suzhou, China Plant. For all other customers whose final consumption is in the remaining global regions, and who order the following AMPMODU MTE assemblies, the manufacturing location will remain in our Hermosillo, Senora, Mexico plant. | Download | |||
08/03/2021 | E-21-005993-C - PCN Cancellation.PCN will not clear by the time the system that the EC and PCN were written in is decommissioned. Hence, this ECR and PCN is being cancelled in the old system and will be rewritten in the New EC system. | Download | |||
06/30/2021 | E-21-005993 - Product Improvement.Addendum to PCN E-20-000650 (ATTACHED). One of the changes noted in PCN E-20-000650 is not being Implemented due to financial implications the tooling change shown in the attached MTE shrouded header tooling change file is being made to be at the molder's discretion. Some parts may have this recessed area, some might not. there is no performance difference between the parts with the recession and the parts without the recession. | Download | |||
05/29/2020 | E-20-000650 - Product Improvement. To provide flexibility to our manufacturing processes, we are allowing the manufacturing plants, when possible, to utilize regrind resin, up to the allowable limit specified on the UL Yellow Card, in the molding process. Adding feature at latch to increase mold efficiency. | Download | |||
03/31/2017 | E-16-014615 - Product Improvement. To satisfy customer demand for the capability of MTE headers to handle RoHS solder temperatures, TE Connectivity has retooled the MTE header product line to use high temperature compatible LCP molding material. These changes will result in the following product changes: 1) Housing material will change from high temperature nylon to LCP. 2) The header housing width will be reduced by 0.005 inches to accommodate the assembly process. 3) In order to consolidate some housing features, the contact cavity configuration will be changed slightly as shown in the attached sketch. | Download |