74441-0001

Heilind Number:	MOL74441-0001
Manufacturer:	Molex
Manufacturer Number:	74441-0001
Datasheet:	Product Specification
ECAD Model:

Description:

0.80mm Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au)

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Specifications

Attribute	Value
Product Category:	High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:	Molex
Manufacturer Part Number:	Molex 74441-0001
Color:	Black
Series:	74441 - SFP - SFP Plus - SFP
Amperage:	.5 A
Connector Type:	SFP, SFP Plus
Gender:	Receptacle
Number of Contacts:	20
Number of Rows:	2
Termination Method:	Surface Mount
Contact Material:	High Performance Alloy (HPA)
Contact Plating:	Gold
Body Orientation:	Right Angle
Pitch:	8 mm
Voltage:	30 V AC/DC
Material:	Thermoplastic
Number of Ports:	1
Orientation:	Right Angle
Keying:	Yes
Component Type:	Receptacle
Operating Temperature Range:	-40 - 85 °C
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	.381 µm
Ground to Panel / PCB:	Yes
Number of Contacts Loaded:	20
Mating Cycles:	200
PCB Locator:	Yes
Shielded:	No
PCB Retention:	Yes
Polarized to PCB:	No
Contact Termination Plating Thickness:	2.540 µm
Polarized to Mate:	Yes
Supplier Product Group:	High Speed Cage & Connector Assemblies
Connector System:	Module to Board
Contact Termination Plating:	Tin
Maximum Solder Process Temperature:	260 °C
Lead Free Process Capability:	REFLOW
Duration at Max. Process Temperature (seconds):	040
Max. Cycles at Max. Process Temperature:	003
Termination Pitch:	.8 mm
Electrical Model:	Yes
Lock to Mating Part:	Yes
Surface Mount Compatible:	Yes
Waterproof Dustproof:	No
Material Flammability Standard:	94V-0
Part Aliases:	0744410001
Contact Detail:	20
SKU:	MOL74441-0001

Detailed Description

Elevate your connectivity with our high-performance black SFP connector, designed for seamless integration in SFP, SFP Plus, and SFP applications. Featuring a right-angle body orientation and surface mount termination method, this receptacle ensures secure and efficient connections. With 20 gold-plated contacts and a voltage rating of 30 V AC/DC, it guarantees reliable power transmission. Operating in a wide temperature range from -40 to 85 °C, this connector is built to withstand harsh environments. Its compact design, with a pitch of .8 mm, allows for high-density mounting on your board. RoHS compliant and lead-free process capable, it meets stringent environmental standards. Trust in the quality and performance of our high-speed cage and connector assemblies for your next project.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 10-89-7200	2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 20 Circuits, 0.76
	Molex 22-23-2041	KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating
	Molex 26-48-1025	KK 396 Breakaway Header, Vertical, Square Pin, with Friction Lock, 2 Circuits, Tin (Sn) Plating
	Molex 26-48-1045	KK 396 Breakaway Header, Vertical, Square Pin, with Friction Lock, 4 Circuits, Tin (Sn) Plating
	Molex 44050-0007	Modular Jack, Right Angle, Low Profile, 8/8
	Molex 47053-1000	KK 254 Vertical Header, with Friction Lock, 4 Circuits, PC Tail Length: 3.50mm
	Molex 71661-2540	1.27mm Pitch EBBI 50D Plug, Right Angle, Blind-Mate, 40 Circuits, 2.79mm PC Tail Length
	Molex 74441-0010	0.80mm Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, Right-Angle, Surface Mount, 20 Circuits, 0.76?m Gold (Au)
	Molex 74737-0009	SFP One Piece Cage, EMI Shielding, 3.05mm Press-Fit Tails

Product Change Notice

Effective Date	Description of Change	Download
12/30/2023	513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs.	Download
11/27/2022	512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product.	Download
03/15/2022	511440 - Equipment/ production transfer or rearrangement. molex will add manufacture source to run the parts at local qualified assembly vendors. regardless of location production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan.	Download
02/17/2020	508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function.	Download
02/23/2019	505857 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move.	Download
05/10/2017	501397 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download
01/03/2015	GCM 10657719 - Manufacturing Process Change.	Download
08/15/2014	GCM 10642993 - Outsourcing Component Or Subcomponent.	Download
08/03/2014	GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products.	Download