| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Hirose |
| Manufacturer Part Number: | Hirose DM3CS-SF |
| Series: | DM3 |
| Overall Width: | 14.1 mm |
| Overall Length: | 13.8 mm |
| SKU: | HIRDM3CS-SF.P |
DM3CS-SF
| Heilind Number: | HIRDM3CS-SF.P |
| Manufacturer: | Hirose |
| Manufacturer Number: | DM3CS-SF |
| ECAD Model: | |
Description:
CUT TAPE - 609-0032-3-00 REEL
Specifications
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Hirose 1473005-1 | SEMI HARD TRAY DDR SOCKET 200P |  |
 | Hirose 640445-2 | 02P MTA156 HDR ASSY FL/STR SN | |
 | Hirose 02-09-2118 | 2.36mm Diameter, Standard .093 Pin and Socket Crimp Terminal, Series 1380, Male, with Tin (Sn) Plated Brass Contact, 18-22 AWG, Bag | |
 | Hirose 29-11-0033 | 2.50mm Pitch Mini-Latch Wire-to-Wire Plug Housing, Friction Lock, without Mounting Ears, 3 Circuits, Natural | |
 | Hirose 39-00-0047 | Mini-Fit Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, 28-22 AWG | |
 | Hirose 43045-0212 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 2 Circuits, with PCB Polarizing Peg, Tin, Glow-Wire Capable, Black | |
 | Hirose 43650-0215 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Polarizing Peg, Tin, Glow-Wire Capable, Black | |
 | Hirose 53398-0771 | 1.25mm Pitch PicoBlade Header, Surface Mount, Vertical, 7 Circuits | |
 | Hirose 70543-0001 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 2 Circuits, 0.38 | |
 | Hirose 70543-0004 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38 | |
 | Hirose 87437-0543 | 1.50mm Pitch Pico-SPOX Wire-to-Board Header, Surface Mount, Vertical, Shrouded, Nylon, 5 Circuits, Embossed Tape on Reel Packaging | |
 | Hirose 87832-1221 | Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead-Free, 12 Circuits, 0.76 | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 08/31/2021 | PC-0009887 - Process Change and addition. Hirose is adding an additional location to build DM3C-SF and DM3CS-SF Both locations are in Japan They will be utilizing different sealing treatments on the contacts. no change to form fit or function | Download | |||
| 08/31/2021 | PC-0009887(3) - Adding additional line and sealing treatment. (1) Plating company: In addition to Company T, Company F will be added.(2) For the sealing treatment solution, in addition to Company T's "TD5900", Company F's "CT-3" will be added. (It differs by the plating company.)(3) The gold-plated area of the contact is only at the contacting part. (Refer to the attachment sheet) Except for the contacting part, it will only be the base Ni plating. | Download | |||
| 08/23/2021 | PC-0009887(4) - Withdrawal Notice. This notification informs you a withdrawal of below process change, which was sent in March 2021. Issue No. PD-0009987 Regarding the process change, defect has occurred partially during an evaluation of changed product. Currently, we are investigating the cause of the defect and considering an improvement method However, since i t requires some time, we decided to withdraw the process change for now to avoid any in convenience due to stagnation. We will inform you again as s oon as we are ready. We sincerely apologize for any inconvenience this may cause to you, and for those who have already approved and started to consider the matter, your understanding and approval will be appreciated. | Download | |||
